E-P11 Silicon wafer cutting fluid wetting agent
Product description
This product is a special alcohol ether alkoxylated non-ionic surfactant with low foam and excellent emulsification, wettability and dispersion characteristics. It also have below features:
Excellent oil removal effect in low temperature
Stable under acid and alkali conditions
Excellent water solubility and cleaning performance
Environmentally friendly and completely biodegradable
Specifications
The data presented on this data page is only typical values, not a technical indicator of the product.
| Appearance at 25 ℃ | Colorless transparent liquid |
Water weight (%) | ≤0.5 |
PH value (1% aqueous solution) | 5-7 |
Active substance content (%) | 99.5 |
Density at 25 ℃ (g/cm3) | 0.99 |
Pour point (℃) | ˂0 |
Flash point (℃) | >100 |
Surface tension (0.1% aqueous solution) dy/cm | Static: 28 Dynamic: 32 |
Cloud point °C (1% aqueous solution) | 32-36 |
Conductivity (10%H2O, 25℃, μS/cm) | ≤10 |
Applications
As the main spray agent in cleaning agents, it can inhibit surfactant foam effectively and has long-lasting defoaming and foam-suppressing effects.
It has excellent wetting performance during silicon wafer cutting, and it helps to meet the requirements for rapid cooling of the diamond wires when they are at high speeds.
Refining degreaser under low-temperature in the textile industry.
Application areas
Silicon wafer cutting, metal processing, oilfields, low foam detergent, textile auxiliaries, degreasers, tableware driers, etc.
